Research on High Precision of Projection Exposure Imaging of Large-Scale Integrated Circuit Lithography Machine

The precision and work efficiency of the distributed repeat projection lithography machine (DSW) directly affect special requirements large-scale integrated circuit production process. In order to improve exposure imaging accuracy projection, paper proposes object image difference in-situ detection (AMF) technology based on particle swarm optimization. article analyzes basic principles this using test marks detect spherical aberration, astigmatism, coma objective, discusses method alignment position coordinates calculate shift caused by aberration. experimental results show that AMF can achieve accurate measurement aberration parameters such as coma, astigmatism.